IMAPS conference

8/05/2011

Intraspec Technologies will take part in the MINAPAD conference, organised by the French chapter of IMAPS. The conference will be held in Grenoble – France, on the 10th and 11th of May 2011. The main topic is the 3D integration of advanced interconnects and packages, and Intraspec will present a publication titled: “Contactless High Resolution Characterization of 3D Current Path in Advanced SiP Packages”.