When there is the need only to localize a defect inside an electronic device, we can offer a fully customized service.
Our advanced technologies, based on non-destructive techniques for failure localization, can precisely identify and isolate defects without de-packaging the component.
The Magnetic Microscopy technique, which involves mapping the magnetic field generated by the currents, produces a high resolution image of the currents flowing inside the sample. Therefore we can help you solve your localization problem without the risk of destroying your sample and losing the defect. We adjust our service to suit the needs of our customers precisely.
We specialize in the localization of defects inside 3D structures: System-in-Packages pose no problem for us.