Intraspec Technologies was founded at the beginning of 2011. We provide customized solutions for semiconductor technologies, specializing in highly complex 3D components, such as System-in-Packages.

In a world where electronics are constantly evolving, the tools and techniques of analysis must be one step ahead. We believe that R&D investment is of fundamental importance: at Intraspec Technologies we are committed to developing Failure Analysis techniques for the future.

It was for this reason that we took part in the development of two patents for 3D Magnetic Microscopy, whose owner is the French Space Agency. We retain exclusive licences of use for such patents.