Failure Analysis

Intraspec Technologies offers services for the Failure Analysis of electronic devices and systems, specializing in the localization of defects in both standard devices and highly complex 3D system-in-packages

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Magnetic Microscopy

This advanced technique of Failure Analysis, which is the core component of our technology, is a contactless and non-destructive method for the precise localization of defects in electronic devices

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Research

The constantly evolving world of microelectronics requires the development of new analysis tools and techniques. INTRASPEC is currently participating in a number of exciting research projects

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How we can help your business

We use the most advanced Failure Analysis techniques to offer a quick and efficient service.

INTRASPEC specializes in the localization of defects in higly complex electronic devices, using innovative methods to find solutions for the most difficult Failure Analysis cases. Reliability is our priority.

INTRASPEC Technologies offers services for the Failure Analysis of electronic devices and systems, specializing in the localization of defects in both standard devices and highly complex 3D system-in-packages.